Discover our specialized range of high-conductivity, free-cutting, and precipitation-hardened copper alloys engineered for microelectronics, aerospace, and energy storage.
Custom high-machinability sulfur copper alloys engineered for high-volume precision turning and superior electrical conductivity.
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OEM engineered high-performance leaded bronze delivering exceptional self-lubricating qualities and wear resistance under extreme pressure.
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Beryllium-nickel copper offering elevated thermal conductivity combined with robust yield strength for severe thermal environments.
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Premium chromium-zirconium copper optimized for resistance welding electrodes, high-current connectors, and continuous casting molds.
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High-strength, fatigue-resistant Beryllium Copper solution suitable for precision spring contacts, diaphragms, and structural foil parts.
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Specialized alloy formulation designed specifically for heavy machinery bushings, automotive thrust washers, and high-friction applications.
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Patented low-oxygen tellurium copper combining superior electrical performance (>98% IACS) with rapid machine-ability.
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Industry-standard C14500 alloy optimized for plasma cutting nozzles, welding tips, and high-speed electrical connector pins.
View DetailsEstablished in May 2017, Sichuan Kepai New Materials Co., Ltd. has grown into a world-class high-tech enterprise focusing on the research, development, continuous casting, precision rolling, and global export of premium high-conductivity, high-strength tellurium copper, beryllium copper foils, and custom special copper alloys.
By integrating advanced oxygen-free vacuum induction melting with proprietary thermo-mechanical treatment technology, Kepai delivers copper foil and alloy products that solve key metallurgical bottlenecks in high-frequency signal transmission, power battery current collection, and high-temperature plasma arc environments.
As the global economy shifts toward electrification, 5G/6G wireless networks, and high-density energy storage, copper foil acts as an indispensable foundational technology.
Ultra-thin electrodeposited (ED) and rolled annealed (RA) copper foils serve as the current collectors for Lithium-ion and Solid-State batteries. High tensile strength and low surface roughness minimize internal resistance while resisting thermal pinhole formation during fast-charging cycles.
In millimeter-wave communication, signal transmission shifts to the surface layer of conductors due to the "skin effect." Kepai's ultra-low-profile (HVLP/VLP) copper foils maintain surface roughness (Rz ≤ 1.2 μm), drastically reducing attenuation losses in high-speed printed circuit boards.
Precision-milled tellurium and beryllium copper alloys yield tight-tolerance IC leadframes, thermal spreaders, and heavy-copper power modules that survive aggressive thermal cycling without mechanical micro-cracking.
Technical comparison of Kepai's flagship export materials. Engineered in compliance with international standards ASTM, JIS, and DIN EN.
| Alloy Grade | UNS Standard | Electrical Conductivity (% IACS) | Tensile Strength (MPa) | Thermal Conductivity (W/m·K) | Key Industrial Application |
|---|---|---|---|---|---|
| Oxygen-Free Tellurium Copper | C14500 / OFT | ≥ 93.0% – 98.0% | 350 – 480 | 355 – 380 | Plasma Nozzles, EV Charging Plugs, Free-Machining Pins |
| Beryllium Copper Foil | C17200 | 22.0% – 28.0% | 1100 – 1380 | 105 – 130 | High-Elastic EMI Shielding, Precision Springs, Diaphragms |
| Beryllium Nickel Copper | C17510 | 45.0% – 60.0% | 650 – 850 | 200 – 240 | Resistance Welding Tips, Injection Mold Core Inserts |
| Chromium Zirconium Copper | C18150 | ≥ 80.0% | 480 – 620 | 320 – 340 | Spot Welding Electrodes, Photovoltaic Ribbon Wire |
| Pure Electrolytic Copper Foil | C11000 / ETP | ≥ 100.0% | 220 – 380 | 386 – 394 | Li-Ion Battery Collectors, Transformer Windings, Flexible PCBs |
| Free-Cutting Sulfur Copper | C14700 | ≥ 90.0% | 300 – 420 | 350 – 370 | Automotive Fasteners, High-Efficiency Turned Electrical Parts |
Kepai products provide targeted material advantages across heavy industrial, aerospace, healthcare, and renewable energy platforms.
Copper exhibits natural antimicrobial, anti-inflammatory, and structural stability properties. High-purity tellurium and oxygen-free copper components are heavily integrated into medical diagnostic tools, MRI shielding rooms, and surgical laser emitters.
Because copper delivers maximum electrical conductivity with reduced volume, Kepai’s C14500 and high-conductivity foils are crucial for high-voltage EV busbars, charging station connectors, drive motor commutators, and battery pack heat sinks.
High-strength Beryllium Copper (C17200) and C19160 alloys provide superior vibration fatigue endurance and spark-proof safety. Essential for flight-control avionics connectors, generator windings, and high-frequency radar harnesses.
Specialized copper alloys demonstrate outstanding resistance to bio-fouling and aggressive marine splash zone corrosion. Used extensively in offshore desalination systems, submerged heat exchangers, and marine valve bodies.
Kepai is a leading global exporter of tellurium copper rods and tubes crafted specifically for plasma torch electrodes and nozzle holders. High machinability coupled with heat dissipation extends consumable service life by up to 35%.
High-purity oxygen-free copper strip and ultra-thin foil form the core interconnect ribbons in high-efficiency solar panels and energy storage system (ESS) power conversion modules.
Backed by rigorous internal laboratory testing and strict alignment with international quality and environmental management standards.
Our dedicated metallurgical engineers operate continuous casting lines and state-of-the-art spectrographs, maintaining absolute control over trace element composition (e.g., oxygen levels < 10ppm in OFHC grades).
Kepai’s patented oxygen-free high-conductivity tellurium copper solves the traditional trade-off between machinability and electrical conductivity, surpassing standard C14500 specifications.
Fully compliant with ISO 9001:2015 (Quality Management), ISO 14001:2015 (Environmental Management), and OHSAS 45001:2018 (Occupational Health and Safety).
Kepai actively participates in drafting National and Industry Standards for tellurium copper and special copper alloys in China, cementing our position as an authoritative industry leader.
All exported copper foils, strips, and rods strictly comply with EU RoHS and REACH environmental directives, featuring eco-friendly low-lead and lead-free options.
Custom export-grade wooden crating, vacuum anti-tarnish foil sealing, and moisture-proof desiccant packing guarantee material integrity during long ocean transits.
In addition to holding a dominant domestic market share in high-performance copper alloys, Kepai products are exported to over 30 countries across North America, Europe, East Asia, and the Middle East.
Kepai’s strategic research focus for next-generation material demands through 2030.
Developing ultra-thin rolled and electrodeposited copper foils with uniform thickness tolerances (±0.15μm) to increase volumetric energy density in next-generation solid-state EV batteries.
Implementing silane coupling and eco-friendly electro-etching treatments to maximize bond strength with PTFE and polyimide substrates while preventing high-frequency signal loss.
Upgrading induction smelting facilities with 100% renewable power and closed-loop scrap recycling systems to reduce the embedded carbon footprint of our export alloys by 60%.
Expert technical insights regarding copper foil selection, alloy customization, export compliance, and delivery timelines.
Kepai utilizes a vacuum-induction oxygen-free smelting process that maintains oxygen levels below 10 ppm. By adding precise trace amounts of tellurium (0.4%–0.7%), we form uniformly dispersed copper telluride (Cu2Te) micro-phases. This structure acts as a natural chip-breaker during high-speed CNC turning without reducing the base copper matrix's electrical conductivity, retaining up to 98% IACS compared to ~85% IACS in leaded brass alternatives.
Electrodeposited (ED) copper foil is produced by electrolytic deposition from a copper sulfate solution onto a rotating titanium drum, yielding a smooth shiny side and a matte side ideal for resin adhesion. Rolled Annealed (RA) foil is manufactured by mechanically reducing copper ingots through consecutive rolling mills. RA foil offers a horizontal grain structure with superior flexural fatigue resistance (ideal for flexible PCBs and dynamic battery tabs), whereas ED foil excels in thinness uniformity for rigid PCB layers.
Copper foils and precision-machined alloys are highly susceptible to oxidation under humid ocean transit conditions. Kepai applies an ultra-thin passivation layer (chromate-free organic anti-tarnish film) onto foil surfaces. Products are then wrapped in anti-corrosion VCI (Vapor Corrosion Inhibitor) film, heat-sealed inside vacuum aluminum foil bags with active silica desiccant, and secured in IPPC ISPM-15 certified wooden cases.
Yes. With an in-house metallurgy lab and custom continuous casting facilities, Kepai routinely produces non-standard copper-nickel-silicon, beryllium-cobalt-copper, and custom sulfur-copper formulations. We support foil micro-slitting down to 10mm widths and custom thicknesses ranging from 6μm up to heavy copper gauge sheets (350μm+).
Every shipment includes an official EN 10204 3.1 Material Test Report (MTR) detailing chemical elemental analysis (spectrometry), tensile strength, elongation percentage, and eddy-current electrical conductivity (% IACS). Additional third-party SGS RoHS, REACH, and Halogen-Free test certificates are available upon request.
Standard inventory items (such as C14500 tellurium copper rods and C11000 pure copper foils) typically ship within 5 to 7 business days. Custom alloy melting, heat treatment, or precision micro-slitting orders generally carry a production cycle of 15 to 25 days depending on total metric tonnage.
Explore our expanded lineup of precision-engineered copper materials, brasses, and specialized bronze alloys.
Wholesale high-conductivity tellurium copper designed for severe duty electrical switchgear and plasma cutting nozzles.
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Ultra-pure OFHC copper maintaining >101% IACS conductivity for vacuum electronics, audio cables, and scientific instrumentation.
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Free-machining tin-phosphor bronze combining high strength, corrosion resistance, and low friction coefficient for precision bushings.
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Custom Electrolytic Tough Pitch pure copper engineered for busbars, grounding systems, and architectural foil laminates.
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Premier raw stock tellurium copper for automated screw machine processing with minimal tool wear and zero arc erosion.
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Leaded precipitation-hardening beryllium copper offering high yield strength matched with enhanced automated machinability.
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CuSn4 phosphor bronze foil and strip engineered for cold-stamped spring terminals, connectors, and relay contacts.
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High-speed free-cutting sulfur copper tailored to minimize manufacturing cycle times for high-volume electrical fittings.
View DetailsConnect directly with Kepai's metallurgical application engineers for technical datasheets, mill test certificates, custom alloy formulations, or instant factory-direct export quotes.
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